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Apple Explores iPhone Chip Packaging in India for the First Time
Apple is in talks with suppliers to manage iPhone chip assembly and packaging in India for the first time, reports The Economic Times. 'Exploratory conversation...
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New 1.4nm nanoimprint lithography template could reduce the need for EUV steps in advanced process nodes — questions linger as no foundry has yet committed to nanoimprint lithography for high-volume manufacturing
Japan’s Dai Nippon Printing DNP claims to have developed a nanoimprint lithography template capable of patterning logic with a feature size of 1.4nm, with plans...
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Intel tests chipmaking tools from sanctioned China-focused tool maker, report claims — move could raise political and national security concerns, firm was backed by CEO Lip-Bu Tan's investment firm
Intel has evaluated wet etch tools from ACM Research for its 14A fabrication process, raising political and national security concerns....
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TMSC ponders upgrading 2nd Japan fab to 4nm — could pave the way for more advanced chips for Japanese customers
TSMC reportedly mulls making 4nm chips in Japan amid putting construction of Fab 23 phase 2 on pause....
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Intel boosts India's chip push with new Tata Group strategic partnership — includes manufacturing and packaging of Intel products for local markets
Intel’s new partnership with Tata signals a transformative step for India’s chip ecosystem, enabling domestic manufacturing, advanced packaging, and enterprise...
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TSMC could be inching closer to making 'all American' chips — report says it is accelerating an advanced packaging facility in Arizona
TSMC may be accelerating its advanced packaging facility in Arizona to package the first processors as early as 2028, ahead of its partner Amkor....
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Intel admits it needs more Core Ultra 200-series wafers — 'If we had more Lunar Lake wafers, we would be selling more Lunar Lake'
Intel needs more Core Ultra 200-series 'Arrow Lake' and 'Lunar Lake' wafers from TSMC as demand exceeds supply....
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SoftBank CEO Masayoshi Son wants to build ‘Trump Industrial Parks’ across the nation, report claims — project proposes using federal land to build manufacturing sites for data center infrastructure
SoftBank proposes building multiple industrial parks across the U.S. on federal land to manufacture semiconductors and other AI infrastructure....
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Chinese tech firm Cambricon looks to step into Nvidia void, triple AI chip production next year — seeks to rival Huawei, but production remains a concern
Chinese tech firm Cambricon Technologies has plans to triple its production of domestic AI chips in 2026, targeting the market dominance of national giant Huawe...
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U.S government awards Gelsinger-backed EUV developer xLight with $150 million in federal incentives — company to develop new electron-based light source for lithography tools
U.S. government to inject up to $150 million in xLight, a startup developing EUV light source based on a particle accelerator, with the first CHIPS and Science...