TSMC could be inching closer to making 'all American' chips — report says it is accelerating an advanced packaging facility in Arizona
Published: (December 6, 2025 at 10:45 AM EST)
1 min read
Source: Tom's Hardware
Source: Tom’s Hardware
Details
TSMC may be accelerating its advanced packaging facility in Arizona to package the first processors as early as 2028, ahead of its partner Amkor.