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  • 2 weeks ago · it

    SK hynix to spend $13 billion on the world's largest HBM memory assembly plant amid the worst shortage on record — South Korea facility to handle packaging and testing for AI memory campus

    SK hynix is investing $12.9 billion to build a campus-scale, HBM-only advanced packaging and test facility in Cheongju, South Korea, designed for the next gener...

    #SK hynix #HBM memory #AI hardware #semiconductor #advanced packaging #memory testing #South Korea #tech investment
  • 1 month ago · it

    TSMC could be inching closer to making 'all American' chips — report says it is accelerating an advanced packaging facility in Arizona

    TSMC may be accelerating its advanced packaging facility in Arizona to package the first processors as early as 2028, ahead of its partner Amkor....

    #TSMC #advanced packaging #semiconductor manufacturing #Arizona #US chip production #Amkor #2028 #foundry
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