The Galaxy S27’s chip could be much cooler thanks to this fundamental change
Source: Android Authority
C. Scott Brown / Android Authority
TL;DR
- The Samsung Exynos 2700 processor will have the CPU and DRAM placed side‑by‑side on the same substrate.
- This layout should improve thermal performance, leading to better sustained performance and cooler device temperatures.
- It builds on the Exynos 2600’s use of a Heat Path Block (HPB) to reduce heating.
Background
The Samsung Exynos 2600 powers the Galaxy S26 and S26 Plus in certain markets. Samsung is now developing the Exynos 2700, which is expected to debut in the Galaxy S27 series.
New Exynos 2700 Design
The Exynos 2700 will feature the processor and DRAM positioned side‑by‑side on a single substrate. This is a departure from earlier Exynos chips, where the DRAM was stacked on top of the processor’s substrate.
The side‑by‑side arrangement is intended to:
- Enhance heat dissipation by reducing the thermal path between the CPU and memory.
- Support higher sustained clock speeds, especially as leaks suggest Arm’s upcoming Ultra CPU core could reach almost 5 GHz (source).
- Potentially incorporate this next‑generation core into the Exynos 2700.
Heat Path Block (HPB)
The Exynos 2600 with its Heat Path Block (HPB).
The Exynos 2600 introduced a Heat Path Block, essentially a heat sink that sat next to the DRAM but above the chipset. With the new side‑by‑side layout of the Exynos 2700, it is plausible that the HPB will now cover both the DRAM and the processor, further improving thermal management.
Implications
If the combination of the HPB and the side‑by‑side CPU/DRAM design proves effective, we could see:
- Better sustained performance for demanding workloads such as high‑end gaming.
- Lower device temperatures, enhancing user comfort and potentially extending component lifespan.
- Improved handling of intensive tasks like heavyweight games or APV video capture (details).