Rapidus explores panel-level packaging on glass substrates for next-generation processors — aggressive plan would help it leapfrog rivals

Source: Tom’s Hardware

Rapidus’ Panel-Level Packaging Initiative

Rapidus plans to outline its early-stage work on panel-level packaging using 600 × 600 mm glass substrates at SEMICON Japan, highlighting an aggressive plan to leapfrog rivals by combining glass‑core substrates and PLP for future AI and HPC chiplet packages.