MediaTek’s new Dimensity chip is designed for budget foldables
Source: 9to5Google
MediaTek Dimensity 7450 and 7450X
MediaTek has launched a new duo of Dimensity chipsets, with one of the new arrivals designed specifically for foldable phones. The announcement was reported by GSMArena.
The Dimensity 7450 and Dimensity 7450X are refreshes of last year’s 7400 series, which were announced in February 2025 (9to5Google).
What’s new?
- Core configuration: 4× Cortex‑A78 cores @ 2.6 GHz + 4× Cortex‑A55 cores @ 2.0 GHz
- GPU: Mali‑G615 MC2
- Connectivity: New 5G R17 modem (Release 17) offering better power efficiency and higher performance during mobility.
- AI: In‑chip NPU provides up to a 7 % boost to AI processing, improving edge‑AI tasks such as AI camera performance and energy savings.
The Dimensity 7450 supports the global 5G standard defined by 3GPP Release 17, delivering higher average speeds, broader coverage, and improved reliability while maintaining excellent power efficiency.
Foldable‑focused variant
As with the prior generation, the standard Dimensity 7400 is aimed at conventional smartphones, while the “X” variant is optimized for foldable devices. The Dimensity 7450X is expected to debut in the 2026 update of the base Motorola Razr (9to5Google leak).
