Everything announced at MWC 2026: The new Leica Leitzphone by Xiaomi, Honor's ultra-thin MagicPad 4 and more

Source: Engadget

Xiaomi × Leica

Xiaomi kicked off MWC by announcing the global launch of its Xiaomi 17 Ultra smartphone, which debuted in China in December and is now rolling out in Europe. The device features a partnership with Leica for a photography‑focused experience:

• Camera system
  • 1‑inch 50 MP sensor with f/1.67 lens
  • Telephoto setup with a 200 MP 1/1.4‑inch sensor
  • 50 MP ultrawide camera
  • Manual zoom ring around the camera module
  • Leica‑designed intuitive camera interface, monochrome mode, and Leica filters
• Display & battery
  • 6.9‑inch OLED, 120 Hz, up to 3,500 nits brightness
  • 6,000 mAh silicon‑carbon battery
• Performance
  • Snapdragon 8 Elite Gen 5 chipset
• Pricing
  • Starts at £1,299 (≈ $1,750)

Leica Leitzphone by Xiaomi (hands‑on)

Leica announced a new phone made in partnership with Xiaomi, the Leitzphone by Xiaomi. Visually and spec‑wise it mirrors the 17 Ultra but carries distinct Leica branding and a few unique touches:

• Same 1‑inch camera sensor with the mechanical zoom ring
• Leica‑styled UI that can hide advanced modes for a cleaner shooting experience
• Monochrome shooting mode and exclusive Leica filters
• Snapdragon 8 Elite Gen 5 chipset, 6.9‑inch 120 Hz display
• Priced at €1,999 (≈ $2,362)

Image by Mat Smith for Engadget

Honor MagicPad 4

Ahead of MWC, Honor unveiled what it claims is the world’s thinnest Android tablet:

• Thickness: 4.8 mm (excluding camera bump)
• Display: 12.3‑inch OLED, 165 Hz
• Weight: 450 g
• Memory & storage: Up to 16 GB RAM, 512 GB storage
• Processor: Qualcomm Snapdragon 8 Gen 5
• Cameras: 13 MP rear, 9 MP front
• Audio: Spatial audio with eight speakers
• Battery: 10,100 mAh, 66 W fast charging
• OS: Honor MagicOS 10

Pricing has not been disclosed yet; further details are expected after Honor’s press conference.

Tecno Modular Concept Smartphone

Tecno presented a modular concept smartphone that can be as thin as 4.9 mm in its base configuration. The design relies on Modular Magnetic Interconnection Technology, allowing users to attach up to ten magnetic modules, including:

• Various camera lenses
• Gaming attachment
• Power‑bank module

The concept showcases how future smartphones might be customized for specific use cases while maintaining an ultra‑thin profile.