The data center cooling state of play (2025) — Liquid cooling is on the rise, thermal density demands skyrocket in AI data centers, and TSMC leads with direct-to-silicon solutions

Source: Tom’s Hardware

Key Takeaways

The rise of AI and hyperscale computing is driving a global shift from air‑based to liquid and embedded cooling as various companies are developing silicon‑integrated systems capable of handling multi‑kilowatt system‑in‑packages that can be commercialized by 2027.