Qualcomm debuts its first Wi-Fi 8-ready chip, commits to launching 6G networks by 2029

Source: 9to5Google

New Qualcomm Chips for 2026 and Beyond

Qualcomm announced a pair of new chips at Mobile World Congress: the X105 5G modem, its fifth‑generation 5G AI processor, and a new RF transceiver. The X105 modem is designed to leverage agentic AI to enhance performance across various user scenarios. The RF transceiver reduces power consumption by 30 % compared to the previous‑generation X85 and shrinks its footprint by 15 %.

FastConnect 8800 – AI‑Native Wi‑Fi 8

Qualcomm’s FastConnect 8800 is positioned as the company’s first Wi‑Fi 8‑ready network interface controller (NIC). Key highlights:

• Peak Wi‑Fi speeds are doubled compared with the previous Wi‑Fi 7‑based FastConnect products (see the earlier announcement here).
• Built on a 6 nm process node.
• Utilises a redesigned 4×4 radio configuration, delivering up to 3× longer gigabit range.
• Adds support for Bluetooth 7.0 and Bluetooth HDT (High Data Throughput), raising the maximum data‑transfer rate to 7.5 Mbps (versus Bluetooth LE’s 2 Mbps limit).

Dragonwing Wi‑Fi 8 Portfolio

The FastConnect 8800 will be part of a broader Dragonwing portfolio targeting IoT and enterprise markets. Qualcomm expects the full suite of Wi‑Fi 8 products to launch in late 2026.

Roadmap to 6G

Qualcomm has formed a “strategic coalition” with unspecified industry partners to pursue a global launch of 6G beginning in 2029. According to the company:

• 6G networks will be AI‑native, supporting connectivity, wide‑area sensing, and high‑performance compute.
• Standards and specifications are slated to be finalized by 2028, enabling interoperable commercial 6G systems by 2029.

The roadmap emphasizes AI‑driven services and anticipates future consumer and enterprise devices that leverage agentic capabilities, although many of these concepts are still in development.