Nvidia CEO denies that US wants to shift 40% of Taiwan's chipmaking capacity to America — Jensen Huang says onshoring is all new capacity, will preserve island nation's silicon shield

Published: 1 day ago (January 29, 2026 at 12:36 PM EST)

1 min read

Source: Tom’s Hardware

Nvidia’s Huang claims that Taiwan will not lose its silicon shield as TSMC expands overseas because demand for leading-edge semiconductor production is so high that a global chipmaking footprint is essential to meet it.

Back to Blog

Ongoing trade war has TSMC and Taiwan stuck between a rock and a hard place — concerns mount surrounding U.S deals cracking the nation's silicon shield

The ongoing trade war puts Taiwan and TSMC in a difficult position. As negotiations continue, the country risks giving up its most precious commodity, the might...

Microsoft won’t stop buying AI chips from Nvidia, AMD, even after launching its own, Nadella says

Microsoft says its own chip leapfrogs those made by other cloud providers like Amazon and Google. But it needs more....

Micron acquires PSMC fab site in Taiwan for $1.8 billion, acquisition to expand the memory maker's operations within the region — move marks the end of the technology-for-capacity era

As fabs get dramatically more expensive than they used to be, technology for capacity partnerships lose their appeal, so Micron buys production facility from PS...

China moves into manufacturing disruptive new semiconductor glass substrates as processor packaging competition intensifies

Glass wafer materials are emerging as a potential and viable alternative to their more conventional, aged organic counterparts....

Related posts

Ongoing trade war has TSMC and Taiwan stuck between a rock and a hard place — concerns mount surrounding U.S deals cracking the nation's silicon shield

Microsoft won’t stop buying AI chips from Nvidia, AMD, even after launching its own, Nadella says

Micron acquires PSMC fab site in Taiwan for $1.8 billion, acquisition to expand the memory maker's operations within the region — move marks the end of the technology-for-capacity era

China moves into manufacturing disruptive new semiconductor glass substrates as processor packaging competition intensifies