iPhone 18 Pro’s new A20 chip rumored to bring two major upgrades
Source: 9to5Mac
Apple’s upcoming A20 Pro chip, slated for the fall‑release iPhone 18 Pro and iPhone Ultra, is generating buzz for two major rumored upgrades.
1. A20 Pro will be the first 2‑nanometer iPhone chip
Apple consistently pushes improvements with each new generation of silicon, and the A20 Pro is expected to be a standout. The chip will be fabricated using TSMC’s new 2‑nanometer process — a step up from the current 3 nm node. This shrink should deliver more power and better efficiency while keeping the chip’s footprint roughly the same.
Apple typically secures advanced process capacity years in advance, ensuring it can leverage cutting‑edge technology not just for iPhones but also for iPads, Macs, and other devices. While the exact performance targets are unknown, the move to 2 nm will give Apple additional headroom for future enhancements.
2. Switch to Wafer‑Level Multi‑Chip Module (WMCM) will bring even more gains
In addition to the 2 nm node, the A20 Pro is rumored to adopt a new packaging technology called Wafer‑Level Multi‑Chip Module (WMCM). According to Marcus, the details are:
For the first time, Apple is set to adopt Wafer‑Level Multi‑Chip Module (WMCM) packaging for its iPhone processors. WMCM allows different components, like the SoC and DRAM, to be integrated directly at the wafer level, before being diced into individual chips.
It uses a technique that connects the dies without needing an interposer or substrate, which can bring both thermal and signal‑integrity benefits.
This innovation means the chip will sit physically closer to its onboard memory, improving performance and potentially lowering power consumption for AI workloads and high‑end gaming. The WMCM approach, combined with the 2 nm process, should make the A20 Pro especially capable at AI tasks—an important factor as iOS 27’s rumored features appear heavily AI‑centric.
What improvements are you most excited about for the iPhone 18 Pro? Let us know in the comments.