Intel is co-developing new Z-Angle Memory to compete with HBM used in AI data centers — vertically-stacked memory touts 2 to 3x more capacity, greater bandwidth, and half the power consumption

Source: Tom’s Hardware

Intel and SoftBank subsidiary, Saimemory, have signed a new collaborative agreement to advance the development and manufacture of a new type of vertical‑stacked memory known as Z‑Angle Memory, or ZAM.