Intel displays tech to build extreme multi-chiplet packages 12 times the size of the largest AI processors, beating TSMC's planned biggest — floorplan the size of a cellphone, armed with HBM5, 14A compute tiles and 18A SRAM
Published: (December 26, 2025 at 09:18 AM EST)
1 min read
Source: Tom's Hardware
Source: Tom’s Hardware
Intel Foundry’s Multi‑Chiplet Processor
Intel Foundry has released a video of a multi-chiplet 2.5D/3D processor with a 10,296 mm² silicon footprint, including leading‑edge technologies such as 14A and 18A.