HBM undergoes major architectural shakeup as TSMC and GUC detail HBM4, HBM4E and C-HBM4E — 3nm base dies to enable 2.5x performance boost with speeds of up to 12.8GT/s by 2027

Source: Tom’s Hardware

Summary

HBM is undergoing its first major architectural overhaul in a decade, as HBM4, HBM4E, and C‑HBM4E will introduce a 2048‑bit interface, logic‑node base dies, and optional custom memory logic inside base dies, enabling up to a 2.5× performance leap between 2025 and 2027.