Big bump, bigger bezels: Fresh Xperia 1 VIII CAD renders back up earlier design leaks
Source: Android Authority
TL;DR
- CAD renders of the Sony Xperia 1 VIII have leaked.
- The phone is slightly wider, thicker, and shorter than its predecessor.
- Bezels return and there is no front‑camera cutout.
New CAD renders confirm earlier leaks
A few weeks after the first speculative renders appeared, factory‑level CAD images of the Xperia 1 VIII have been released. In partnership with tipster OnLeaks, My Mobiles shared the renders, which show Sony moving away from the vertical rear‑camera bar in favor of a square‑shaped camera island.
Dimensions and display
- Xperia 1 VIII: 161.9 mm × 74.4 mm × 8.58 mm
- Xperia 1 VII: 162 mm × 74 mm × 8.2 mm
The new model is therefore a touch wider, a bit thicker, and slightly shorter than the previous generation, while retaining the same 6.5‑inch display size.
Front‑camera design and bezels
Earlier rumors suggested a bezel‑less front panel with a camera cutout. The CAD renders indicate that Sony is bringing back the top bezel and that the front camera is hidden within it—no visible cutout is present.
Redesigned camera bump
- Height of the new camera island: 2.79 mm
- Resulting total phone thickness: 11.37 mm
For comparison, the Xperia 1 VII’s camera bump measured about 1.1 mm, giving a total thickness of roughly 9.3 mm.
Launch outlook
Sony announced the Xperia 1 VII in mid‑May of last year, with availability following about a month later. No official launch date has been confirmed for the Xperia 1 VIII yet.